The International Workshop on Advanced Chip Microsystems: Development of 3-D Heterogeneous Integrated Circuits Technology and Industry in the Post-Moore Era was successfully held in Tianjin

　　On October 25th and 26th, 2019, the International Workshop on Advanced Chip Microsystems: Development of 3-D Heterogeneous Integrated Circuits Technology and Industry in the Post-Moore Era was successfully held in Tianjin University in Weijin Road Campus, Tianjin University.

　　The workshop is sponsored by Tianjin University, organized by both Tianjin Key Laboratory of Imaging and Sensing Microelectronic Technology, School of Microelectronics, and Tianjin University. The workshop consisted of four parts: the opening ceremony, invited talks, poster demonstrations and the group discussion.

　　The school invited 8 IEEE Fellows to attend the workshop and give keynote talks to share their recent academic achievements and visions of the trends in the IC and microsystem fields. The invited experts included the Fellow of the Canadian Academy of Engineering and the Fellow of the Royal Society of Canada, professor at Polytechnique Montreal, Ke Wu; professor at Georgia Institute of Technology, Madhavan Swaminathan; professors at University of Pavia, Luca Perregrini and Maurizio Bozzi; the fellow of Canadian Academy Engineering, professor at The Chinese University of Hong Kong, Ming Yu; professor at Singapore University of Technology and Design, Yeo Kiat Seng; Changjiang Distinguished Professor at Zhangjiang University, Dean for Zhejiang University - University of Illinois at Urbana-Champaign Institute, Er-Ping Li; and the fellow of Canadian Academy Engineering, professor at Tianjin University / Carleton University, Qijun Zhang.

　　After previous extensive invitations and calls for poster submission, the workshop attracted more than 80 attendees including well-known experts, young scholars, student representatives from universities, representatives from well-known companies, and faculties and students from the school of microelectronics.

　　On October 25 and 26, the invited talks were hosted in the lecture hall on the first floor of the Science Library, and building No.26 B-103, respectively. The workshop was opened at 9:00 am on October 25, and the venue was packed with audience. The opening ceremony was hosted by the fellow of Canadian Academy Engineering, Professor of Tianjin University / Carleton University, Qijun Zhang. The assistant to the president of Tianjin University, Prof. Lixin Zhang, attended the opening ceremony and gave the welcome speech. Firstly, he welcomed the distinguished professors for coming to Tianjin University. Then he addressed that the school of microelectronics at Tianjin University as one of the national demonstrative microelectronics school under construction and preparation, relied on the Tianjin IC Design Center to plan the relevant integrated circuits research policies and innovation environment in the post-Moore era. The school of microelectronics taking the 3-D heterogeneous integration technology as the breakthrough point, and firstly proposed to establish the “heterogeneous chip microsystem +” platform among universities nationwide. Focusing on 3-D heterogeneous integrated circuit technology is expected to solve the bottleneck of the development of the national integrated circuit industry and promote key breakthroughs and leaping development in the design, process, packaging and testing industries of 3-D chip microsystems.

Group photo of the workshop attendees

Welcome speech from the assistant to the president of Tianjin University, Prof. Lixin Zhang

　　After the opening ceremony, Prof. Qijun Zhang and the dean of the school of microelectronics, Prof. Kaixue Ma co-hosted the invited talk sessions. Eight experts gave invited talks with the titles of Ultra-Broadband and Ultra-Fast Technology - Calling for Cooperative Integrated Electronics and Photonics, Heterogeneous Integration Platform for Computing and mmWave Applications, New Development of Microwave Network Theory and Applications, Spoof Surface Plasmonic Graphene Like Structure for Microwave and THz Devices, Numerical techniques for electromagnetic modelling of microwave and mm-wave components, Device optimization and its application to design fully-integrated low-noise amplifiers for multi-standard communications, Engineering the Resonant Modes in Substrate Integrated Waveguide (SIW) Technology, and Neural Networks for Microwave Design, respectively. The experts and the audience engaged in close interactions during the Q&A.

Distinguished talks from 8 invited experts

　　This workshop specially set up a poster display session to strengthen the interaction between experts and audiences, to promote the discussion and the exchange of academic views. During the breaks between the talks, more than 60 poster submissions collected were displayed in the venues. Experts and audience all engaged in free and full communication around the contents of the posters in a lively atmosphere.

　　In the afternoon of October 26, the discussion between the invited experts and the research groups of Tianjin Key Laboratory of Imaging and Sensing Microelectronic Technology were held in the main meeting room in the school of microelectronics, building No. 20. The discussions were detailed and focused on the aspects of talents training, academic research, international cooperation and “111 Talents Recruit” Program. The invited experts provided valuable suggestions for how to further strengthen effective inter-university international exchanges and cooperation in the future.

Group discussions between the invited experts and the faculties in the school of microelectronics

　　The international workshop provided an exchange and communication platform for the experts, teachers and students, and exhibited the recent progresses internationally in the research fields of integrated circuits and microsystems. The success of the workshop strongly propelled the further development of the “heterogeneous chip microsystem +” platform in the school of Microelectronics, Tianjin University.